This section is a technical reference for UMTS, LTE, and NR modules that are integrated into the modems listed in our system. Listing every module is a near-impossible feat so this resource is not comprehensive. However as more modems are added the list of modules will be expanded.
Modem Modules Explained
Today's mobile broadband modems are developed by integrating existing components. Engineering a device entirely from the ground up is an inefficient and highly costly approach. Developers instead use commercial off-the-shelf chips and modules to integrate into their mainboard or SBC.
A small number of expert module vendors manufacture high performance System-on-a-Chip (SoC) modem modules that are made available to companies wishing to build commercial modems. These modules are generally either in the form of a surface mount chip that is designed to be integrated into the PCB during production, or pinout through an M.2 or mini PCIe interface for integration later in the manufacturing process.
Notable module vendors include Sierra Wireless, Telit, and Quectel.
Module vendors themselves don't reinvent the wheel each time, most use an existing chipset that forms the RF transceiver and front-end of the system. Common chipsets you may encounter include Qualcomm Snapdragon and HiSilicon Balong.